AMD Already Taped Out Radeon R9 380X GPU - AMD's Employee Lists Development Of 300W 2.5D HBM GPU SOC

While it is known that AMD is preparing their next generation Radeon R300 series to tackle NVIDIA'south highly efficient Maxwell graphics cards, it looks similar the cards accept been in development for a while and are already taped out equally seen through LinkedIn profiles of AMD employees. The two cards evidence that AMD has put all of their development team in the production of true adjacent generation parts which are presumably known as the "Male monarch of the Hill" series (might just exist an internal condename).

AMD Radeon R9 380X GPU Taped Out - Development of 300W HBM GPU SOC Complete

The data suggests some bizarre specifications coming from AMD and from the looks of it, these might just be the almost powerful update AMD might deliver to consumers later on several years. According to the profile of Linglan Zhang, who is currently employed every bit the Organization Architecture Manager at AMD, it seems like a GPU SOC making use of stacked die HBM (High Bandwidth Retentivity) has already been adult. Nevertheless, the about surprising bit regarding this news is that the GPU SOC flake which is based on a 2.5D detached design has a TDP of 300W. The manager lists it as the world's kickoff 300W GPU SOC always to be adult and this single fleck might just advise that AMD is sticking to the 28nm process node. As previously speculated, the Maxwell and Radeon R300 series might be the final chips to feature the 28nm node while unleashing the full potential from both specific architectures utilizing massive die size.

From the looks of it, the 300W GPU SOC which features the HBM specifications would be integrated inside AMD's next generation flagship Radeon R9 390X graphics card whose specifications have been leaked from various sources before however it's hard to say whether any of the listed specifications are truthful. The but thing that we have factual specifications regarding is the HBM memory which was leaked in a presentation few months ago.

AMD has already started sampling first generation HBM with their graphics cards. The specifications of the HBM retention are interesting featuring a voltage of 1.2 – ii.5V with the DRAM Dice density of ii Gb per stack, each stack featuring four DRAM modules. The jitney interface would be 1024-bit wide and the command interface would be the traditional DDR (GDDR for graphics units). Each stack would be made up of a logic die which will characteristic a ii.5D or 3D interface on which four DRAMs would be stacked. This stacked layer would be fused on the PCB simply like the regular memory fries but would deliver high performance every bit the name suggests (HBM = High Bandwidth Retentivity).

AMD High-Bandwidth Retentiveness Blueprint Specifications (TSMC):

	GDDR5	2-How-do-you-do HBM 'Stacked DRAM'	4-Hi HBM 'Stacked DRAM'
I/O	32	512	1024
Max Bandwidth Per Pin	7 Gbps	i Gbps	i Gbps
Max Bandwidth	28 GBps	64 GBps	128-256 GBps
Voltage	1.35 – 1.65	~i.2	~1.two
Command Input	Unmarried	Dual	Dual
Layers	i	2 + 1	4 + 1

AMD Radeon R9 390X Speculation Specifications:

	Fiji XT (R9 390X)	GM204 (GTX 980)	Hawaii (R9 290X)
CUDA/GCN Cores	4096	2048	2816
Memory Capacity	4GB HBM	4GB GDDR5	4GB GDDR5
Memory Clock Speed	1Ghz	7Ghz Constructive	5Ghz Effective
Retentiveness Bandwidth	640GB/s	224GB/s	320GB/south
Boost Clock Speed	i.25Ghz	~ane.2Ghz	1Ghz
Manufacturing Process	TSMC 28nm	TSMC 28nm	TSMC 28nm

AMD Radeon R9 380X Taped Out

The 2d information is the most meaning since it lists an bodily proper name of the upcoming graphics card. The Radeon R9 380X which is presumably featuring a chip that would exist identical to Hawaii merely much better in terms of implementation has been listed by AMD's ASIC physical blueprint engineer "IIana Shternshain" who has worked on taping out both the AMD Radeon R9 290X graphics menu and besides the upcoming Radeon R9 380X GPU. It's impressive that AMD is actually going all out with next generation technology producing powerful chips since competition lies ahead against NVIDIA'south own GM200 GPU core. It remains to be seen what the actual specifications of these graphics processing units would be once they are finalized in the months ahead. The AMD Radeon R9 380X graphics carte du jour would as well utilize the 28nm process node however the manufacturing company should about likely make transition to Global Foundries from TSMC. Both choices remain to AMD but nosotros are keen to run into what new graphics update AMD is going to bring later in 2022.